1. New and improved technologies, devices and integrated circuits featuring submicron lithographic dimensions and layer stack control;
2. Improved thermal management system capable of efficiently cooling the RF module and making use of the dissipated heat energy in an efficient way;
3. Intelligent electromagnetic field controllers optimising the microwave energy transfer to the food and the energy distribution within the food that will use monolithic microwave integrated circuits;
4. Optimised configuration and systems architecture delivering optimum efficiency of the hardware, firmware and software components.